By applying the strong electric fields to bicrystal samples, the intrinsic adhesive strength of grain boundaries of general type in tungsten is experimentally explored. It is obtained that a substantial influence on the electrostatic strength in the process of the field evaporation is caused by spatial charge. The strength of tungsten bicrystals containing the boundaries of general type was (12,5 - 20,4) GPa that exceeds the strength of macrocrystals by more than an order of magnitude. The maximal values of strength in the whole range of the diameters explored did not show the scale dependence. This fact indicates the first achievement of the true cohesive strength of grain boundaries.

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